Top solder kester lead free

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Best solder kester lead free

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Kester 24-6337-8800 50 Activated Rosin Cored Wire Solder Roll, 245 No-Clean, 63/37 Alloy, 0.031 Kester 24-6337-8800 50 Activated Rosin Cored Wire Solder Roll, 245 No-Clean, 63/37 Alloy, 0.031" Diameter
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KESTER SOLDER 83-7068-1402 Solder Pocket, Pack No Lead 0.031 Diameter, 1.5 KESTER SOLDER 83-7068-1402 Solder Pocket, Pack No Lead 0.031 Diameter, 1.5"
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Kester443-858 24-9574-1400 K100Ld Lead-Free Rosin Wire Solder.062 Kester443-858 24-9574-1400 K100Ld Lead-Free Rosin Wire Solder.062" Diameter-Low Cost Alloy
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Kester443-845 24-9574-7618 K100Ld Lead-Free No Clean Wire Solder.031 Kester443-845 24-9574-7618 K100Ld Lead-Free No Clean Wire Solder.031" Diameter-Low Cost Alloy
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Kester 24-9574-6403 K100LD Lead-Free Water Soluble Wire Solder.031 Kester 24-9574-6403 K100LD Lead-Free Water Soluble Wire Solder.031" Diameter-Low Cost Alloy
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Kester24-7068-7601 Wire 96.5/3/0.5 Sn/Ag/Cu 217C 1Lb Kester24-7068-7601 Wire 96.5/3/0.5 Sn/Ag/Cu 217C 1Lb
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Kester 24-9574-7610 K100LD Lead-Free No Clean Wire Solder.020 Kester 24-9574-7610 K100LD Lead-Free No Clean Wire Solder.020" Diameter-Low Cost Alloy
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Kester Solder 24-7068-7603 Lead Free Wire Solder - #58/275 No-Clean Kester Solder 24-7068-7603 Lead Free Wire Solder - #58/275 No-Clean
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Kester 24-7068-7603 Kester 24-7068-7603"275" No-Clean Lead-Free Wire Solder.020" Diameter
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(0.6mm,100g) Lead-free Solder Wire Flux-core Solder Welding Wire Electrical Soldering with Rosin Core,Sn99 Cu0.7 Ag0.3 0.22 lbs (0.6mm,100g) Lead-free Solder Wire Flux-core Solder Welding Wire Electrical Soldering with Rosin Core,Sn99 Cu0.7 Ag0.3 0.22 lbs
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1. Kester 24-6337-8800 50 Activated Rosin Cored Wire Solder Roll, 245 No-Clean, 63/37 Alloy, 0.031" Diameter

Feature

Wire gauge: 20 awg, 21 swg, 50 core and core size: 1.1 inch
0.031 inch
Compatible with leaded and lead-free alloys

Description

24-6337-8800
245 No-Clean Flux Solder will create visually acceptable assemblies without the need and expense of cleaning. Solderability and efficiency are comparable to that of mildly activated rosin flux (RMA). Residues are non-corrosive, non-conductive and do not require removal in most applications.

2. KESTER SOLDER 83-7068-1402 Solder Pocket, Pack No Lead 0.031 Diameter, 1.5"

Feature

0.31" Diameter
Lead-Free
96.5% Sn

Description

0.031" Diameter Lead-Free Solder Pack- 96.5% Sn 3% Ag 0.5% Cu New Lead-Free Pocket Pak Featuring Original Kester Solder And Tubes. 96.5% Sn (Tin) 3% Ag (Silver) 0.5% Cu (Copper) 0.031"" Diameter".

3. Kester443-858 24-9574-1400 K100Ld Lead-Free Rosin Wire Solder.062" Diameter-Low Cost Alloy

Feature

Alloy: eutectic tin/copper core size: 66
Diameter: 0.062 inch
Flux type: activated rosin
Lead-Free: Yes Melting Point: 441F

Description

Kester 24-9574-1400 K100LD Lead-Free Rosin Wire Solder.062" Diameter-Low Cost Alloy, Country of Origin - United States, Manufacturer name - Kester.

4. Kester443-845 24-9574-7618 K100Ld Lead-Free No Clean Wire Solder.031" Diameter-Low Cost Alloy

Feature

Alloy: eutectic tin/copper core size: 66
Diameter: 0.031 inch
Flux type: no-clean lead-free: yes
Melting Point: 441F

Description

Kester 24-9574-7618 K100LD Lead-Free No Clean Wire Solder.031" Diameter-Low Cost Alloy, Country of Origin - United States, Manufacturer name - Kester.

5. Kester 24-9574-6403 K100LD Lead-Free Water Soluble Wire Solder.031" Diameter-Low Cost Alloy

Feature

Alloy: Eutectic Tin/Copper Core Size: 66 Diameter: 0.031" Flux %: 66/3.3 Flux Type: Water-Soluble Lead-Free: Yes

Description

K100LD is a eutectic Tin/Copper alloy with controlled metallic dopants to control the grain structure within the solder joint, and to minimize the dissolution of copper into the solder pot. K100LD virtually eliminates the occurrence of common defects such as icicling and bridging.

6. Kester24-7068-7601 Wire 96.5/3/0.5 Sn/Ag/Cu 217C 1Lb

Feature

Price for: each external diameter - metric: 0.787Mm external diameter - imperial: 0.031&Quot
Solder gauge awg: 21Awg solder alloy: 96.5, 3, 0.5 sn, ag, cu melting temperature: 217
C weight: 453.592G rohs compliant: yes

Description

KESTER 24-7068-7601 SOLDERWIRE 96.5/3/0.5 SN/AG/CU 217C 1LB., Country of Origin - United States, Manufacturer name - Kester.

7. Kester 24-9574-7610 K100LD Lead-Free No Clean Wire Solder.020" Diameter-Low Cost Alloy

Feature

Alloy: Eutectic Tin/Copper.Core Size: 66
Diameter: 0.020".Flux %: 66/3.3
Flux Type: No-Clean
Lead-Free: Yes
Melting Point: 441F

8. Kester Solder 24-7068-7603 Lead Free Wire Solder - #58/275 No-Clean

Feature

Wire diameter: .020 inch
Alloy: Sn96.5/ Ag3.0/ Cu0.5 (96.5 percent tin, 3 percent silver, 0.5 percent copper)
Melting range: approximately 423-428 f, 217-330 c
Core size: 58 (medium core 2.2 percent flux) no clean - 1 lb spool

Description

275 inch lead free no-clean solder is designed to reduce spattering common to most core flux solders. No-clean solder eliminates the need and additional expense of residue removal while providing excellent solderability and fast wetting to a variety of surface finishes.

9. Kester 24-7068-7603"275" No-Clean Lead-Free Wire Solder.020" Diameter

Feature

Alloy: Sn96.5/Ag3.0/Cu0.5 Core Size: 58 Diameter: 0.020" Flux Type: No-Clean Lead-Free: Yes

Description

Kester 24-7068-7603 "275" no-clean lead-free wire solder,.020" diameter.

10. (0.6mm,100g) Lead-free Solder Wire Flux-core Solder Welding Wire Electrical Soldering with Rosin Core,Sn99 Cu0.7 Ag0.3 0.22 lbs

Feature

Net Weight of Lead-free Solder: 100g (0.22lb) Diameter: 0.6 mm (0.0236 In)
Relative parameters: the diameter of the electrical no-lead soldering wire is 0.6 mm; SAC: Sn/ Ag/ Cu: 99%/ 0.3%/ 0.7%; Flux: 2%
The melting point of soldering iron wire is 215 - 220 degrees Celsius/ 419 - 428 degrees Fahrenheit;
Lead-free solder wire: lead-free solder wire with rosin flux core
Wide application: the rosin core leadless solder wire is designed for electrical repairs (radios, TVs, VCRs, stereos, wires, motors, circuit board, and so on).

Description


Lead Free Solder Wires are soldering materials for engineering, and electronic repairs.
Lead-free tin-silver-copper alloy for simple applications.

Tin-Silver-Copper (Sn-Ag-Cu, or "SAC") solders
based on the reduced melting point of the Sn-Ag-Cu ternary eutectic behavior (217 C),
which is below the 22/78 Sn-Ag (wt.%) eutectic of 221 C and the 59/41 Sn-Cu eutectic of 227 C

Rosin Flux
Rosin flux , used in electronics, where the corrosiveness of the vapors released when acid flux is heated would risk damaging delicate circuitry.
Flux is a reducing agent designed to help reduce metal oxides at the points of contact to improve the electrical connection and mechanical strength

Tin / Silver / Copper: 99% / 0.3% / 0.7%; Lead free
Flux: 2%
Weight: 100g (0.22lb)
Diameter: 0.6 mm
Melting point:215 C - 220 C (419F - 428F)
Package Included
1 Spool Solder Wire

Conclusion

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